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ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.
ACTIVE
LEI: 549300ZFFY4BYGZ1AX14
ISSUED
Malaysia, KUALA LUMPUR, LEVEL 13, MENARA 1 SENTRUM 201, JALAN TUN SAMBANTHAN, BRICKFIELDS, 50470
Legal name
ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.
Registered at
Corporate Registry (Companies Commission of Malaysia)
(Suruhanjaya Syarikat Malaysia (SSM))Malaysia, Malaysia
RA000439
Registration authority entity ID
202001040513
Legal jurisdiction
MY
Entity category
GENERAL
Entity legal form code
Private Company (en)
XEOV
Entity status
ACTIVE
Entity created at
2021-10-29
Addresses
Legal Address
LEVEL 13, MENARA 1 SENTRUM 201
JALAN TUN SAMBANTHAN, BRICKFIELDS
50470
KUALA LUMPUR
MY-14
MY | Malaysia
Headquarters Address
LEVEL 13, MENARA 1 SENTRUM 201
JALAN TUN SAMBANTHAN, BRICKFIELDS
50470
KUALA LUMPUR
MY-14
MY | Malaysia
Registration details
LEI initial registration date
2021-11-01
LEI last update date
2024-08-29
LEI registration status
ISSUED
LEI next renewal date
2025-10-27
Managing LOU
LONDON STOCK EXCHANGE LEI LIMITED (LONDON STOCK EXCHANGE LEI LIMITED)
Validation sources
FULLY_CORROBORATED
Validated at
Corporate Registry (Companies Commission of Malaysia)
(Suruhanjaya Syarikat Malaysia (SSM))Malaysia, Malaysia
RA000439
Validated as
202001040513
Relationships
Parents
ASSEMBLY PAYMENTS PTE. LTD. (Direct Parent)
STANDARD CHARTERED PLC (Ultimate Parent)
Direct children
No direct child data available
Ultimate children
No ultimate child data available
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